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 IPP07N03L IPB07N03L OptiMOS(R) Buck converter series
Feature
*N-Channel
Product Summary VDS RDS(on) max. SMD version ID
P- TO263 -3-2
30 5.9 80
P- TO220 -3-1
V m A
*Logic Level *Low On-Resistance R DS(on) *Excellent Gate Charge x RDS(on) product (FOM)
*Superior thermal resistance
*175C operating temperature *Avalanche rated *dv/dt rated *Ideal for fast switching buck converters
Type IPP07N03L IPB07N03L
Package Ordering Code P- TO220 -3-1 Q67042-S4051 P- TO263 -3-2 Q67042-S4082
Marking 07N03L 07N03L
Maximum Ratings, at Tj = 25 C, unless otherwise specified Parameter Continuous drain current1)
TC = 25C ,1)
Symbol ID
Value
Unit A
80 80
Pulsed drain current
TC=25C
ID puls
320
Avalanche energy, single pulse
ID=20A, V DD=25V, RGS=25
EAS
30
mJ
Repetitive avalanche energy, limited by Tjmax 2) Reverse diode dv/dt
IS=80A, VDS=24V, di/dt=200A/s, Tjmax=175C
EAR dv/dt
15 6 kV/s
Gate source voltage Power dissipation
TC=25C
VGS Ptot
20 150
V W
Operating and storage temperature IEC climatic category; DIN IEC 68-1
Tj , Tstg
-55... +175 55/175/56
C
Page 1
2002-10-17
IPP07N03L IPB07N03L
Thermal Characteristics Parameter Symbol min. Characteristics Thermal resistance, junction - case SMD version, device on PCB:
@ min. footprint @ 6 cm2 cooling area 3)
Values typ. max.
Unit
RthJC RthJA
-
0.68
1
K/W
-
-
62 40
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain-source breakdown voltage
VGS=0V, I D=1mA
Values typ. max.
Unit
V(BR)DSS
30
-
-
V
Gate threshold voltage, V GS = VDS
ID = 80 A
VGS(th)
1.2
1.6
2
Zero gate voltage drain current
VDS=30V, V GS=0V, T j=25C VDS=30V, V GS=0V, T j=125C
IDSS IGSS 0.01 10 1 1 100 100
A
Gate-source leakage current
VGS=20V, VDS=0V
nA
Drain-source on-state resistance
VGS=4.5V, ID=50A VGS=4.5V, ID=50A, SMD version
RDS(on) RDS(on) 5 4.6 6.2 5.9 7 6.6 10 9.7
m
Drain-source on-state resistance4)
VGS=10V, ID=50A VGS=10V, ID=50A, SMD version
1Current limited by bondwire ; with an RthJC = 1K/W the chip is able to carry ID= 123A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not subject to production test. 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. 4Diagrams are related to straight lead versions
Page 2
2002-10-17
IPP07N03L IPB07N03L
Electrical Characteristics Parameter Symbol Conditions min. Dynamic Characteristics Transconductance gfs
VDS2*ID*RDS(on)max , ID=80A
Values typ. max.
Unit
44
88
-
S
Input capacitance Output capacitance Reverse transfer capacitance Gate resistance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total
Ciss Coss Crss RG t d(on) tr t d(off) tf
VGS=0V, VDS =25V, f=1MHz
-
1900 740 175 2.2 10.4 23 73 61
2350 990 265 15.6 35 109 91
pF
ns
VDD=15V, VGS=10V, ID=20A, RG =3.6
-
Q gs Q gd Qg
VDD=15V, ID=20A
-
5 16 27
7 25 34
nC
VDD=15V, ID=20A, VGS=0 to 5V
-
Output charge
Q oss
VDS=15V, ID =20A, VGS=0V
-
26.4
33
nC
Gate plateau voltage
V(plateau)
VDD=15V, ID=20A
-
3.1
-
V
Reverse Diode Inverse diode continuous forward current Inv. diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge ISM VSD trr Qrr
VGS =0V, IF=80A VR =15V, IF =lS , diF/dt=100A/s
IS
TC=25C
-
0.9 41 46
80 320 1.3 51 58
A
V ns nC
Page 3
2002-10-17
IPP07N03L IPB07N03L
1 Power dissipation Ptot = f (TC) 2 Drain current ID = f (TC) parameter: VGS 10 V
160
IPP07N03L
90
IPP07N03L
W
A
120
70 60
P tot
100
ID
50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 C 190
80
60
40
20
0 0
20
40
60
80
100 120 140 160 C 190
TC
TC
4 Max. transient thermal impedance ZthJC = f (tp) parameter : D = tp/T
10 1
IPP07N03L
3 Safe operating area ID = f ( VDS ) parameter : D = 0 , T C = 25 C
10 3
IPP07N03L
K/W A
/I
D
tp = 22.0s
10 0
V
DS
10 2
ZthJC
R
DS (on )
ID
100 s
10 -1
=
10 -2 D = 0.50
1 ms
0.20 10
-3
10
1 10 ms
0.10 0.05 single pulse 0.02 0.01
DC 10 -4
10 0 -1 10
10
0
10
1
V
10
2
10 -5 -7 10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 4
tp
2002-10-17
IPP07N03L IPB07N03L
5 Typ. output characteristic ID = f (VDS); Tj=25C parameter: t p = 80 s
190
IPP07N03L Ptot = 150W
6 Typ. drain-source on resistance RDS(on) = f (ID) parameter: VGS
20
IPP07N03L
A
h i
m
VGS [V] a 3.0 b 3.2 3.4 3.6 3.8 4.0 4.5 10.0 5.0
d
e
f
g
160 140
g
16
c d
RDS(on)
14 12 10 8
ID
120 100 80 60 40
c e
e f g h
fi
6
d h i
4
b a
20 0 0
2 0 0
VGS [V] =
d 3.6 e f 3.8 4.0 g h i 4.5 10.0 5.0
1
2
3
4
5
6
V
8
20
40
60
80
100
120
A
160
VDS
7 Typ. transfer characteristics ID= f ( VGS ); VDS 2 x ID x R DS(on)max parameter: t p = 80 s
160
ID
8 Typ. forward transconductance gfs = f(ID); Tj=25C parameter: gfs
120
S A
100 120 90
100
gfs
0.5 1 1.5 2 2.5 3 3.5 4
ID
80 70
80
60 50
60 40 40 30 20 20 10 0 0
V5 VGS
Page 5
0 0
20
40
60
80
A ID
120
2002-10-17
IPP07N03L IPB07N03L
9 Drain-source on-state resistance RDS(on) = f (Tj) parameter : ID = 50 A, V GS = 10 V
IPP07N03L
10 Typ. gate threshold voltage VGS(th) = f (Tj) parameter: VGS = VDS
3
m
15
V
12
RDS(on)
11 10 9 8 7 6 5 4 3 2 1 0 -60 -20 20 60 100 140
C
V GS(th)
1mA
2
98%
1.5
typ
83A
1
0.5
200
0 -60
-20
20
60
100
C
180
Tj
11 Typ. capacitances C = f (VDS) parameter: VGS=0V, f=1 MHz
10 4
Tj
12 Forward character. of reverse diode IF = f (VSD ) parameter: Tj , tp = 80 s
10 3
IPP07N03L
A
pF
Ciss
10 2
C
10 3
Coss
IF
10 1
Crss
Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%)
10 2 0
5
10
15
20
V
30
10 0 0
0.4
0.8
1.2
1.6
2
2.4 V
3
VDS
Page 6
VSD
2002-10-17
IPP07N03L IPB07N03L
13 Typ. avalanche energy EAS = f (Tj) par.: I D = 20 A, V DD = 25 V, RGS = 25
30
15 Drain-source breakdown voltage V(BR)DSS = f (Tj) parameter: I D=10 mA
36
IPP07N03L
V
mJ
V(BR)DSS
34 33 32
E AS
20
15 31 10 30 29 5 28 0 25 27 -60
45
65
85
105
125
145
C 185 Tj
-20
20
60
100
140
C
200
Tj
14 Typ. gate charge VGS = f (Q Gate) parameter: I D = 20 A pulsed
16
V
IPP07N03L
12
VGS
10
0.2 VDS max 0.5 VDS max
8
6 0.8 VDS max
4
2
0 0
10
20
30
40
50
nC
65
Q Gate
Page 7
2002-10-17
IPP07N03L IPB07N03L
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 8
2002-10-17


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